Home > Search Results: keywords:"solder globule method"
Search:
Search Tips :: Advanced Search
Search collections:
Sort by: Display results: Output format:
National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
Wetting Balance Method Modification for SMD Wettability Measuring
 Drab, Tomáš ; Kahle, Petr (referee) ; Starý, Jiří (advisor)
Project presents main influence on wettability of SMD and PCB using solder SAC 305 and testing possibilities. We have designed modificaton of wettability balance method leading to the solder globule method. We were testing thermal profile difference and then we determined thermal difference compensation. We were testing few types of SMD packages terminations and PCB´s surface protections, with two solders and two fluxes. We were comparing their wetting forces, wetting speed, and wetting stability. We have proposed other possibilities to optimisation of the method and testing.
Detailed record
Wetting Balance Method Modification for SMD Wettability Measuring
 Drab, Tomáš ; Kahle, Petr (referee) ; Starý, Jiří (advisor)
Project presents main influence on wettability of SMD and PCB using solder SAC 305 and testing possibilities. We have designed modificaton of wettability balance method leading to the solder globule method. We were testing thermal profile difference and then we determined thermal difference compensation. We were testing few types of SMD packages terminations and PCB´s surface protections, with two solders and two fluxes. We were comparing their wetting forces, wetting speed, and wetting stability. We have proposed other possibilities to optimisation of the method and testing.
Detailed record

Interested in being notified about new results for this query?
Subscribe to the RSS feed.
Digital Repository :: Search :: Submit :: Personalize :: Help
Powered by Invenio v1.1.2
Maintained by admin.invenio@techlib.cz
This site is also available in the following languages:
Česky  English